Generally most memory uses standardized physical/electrical/firmware interfaces from JEDEC, an industry consortium. I do not know for certain if the iPhone memory is standard.
Mobile RAM/Flash packages are usually made in larger capacities by stacking several dies within a package. This can involve die thinning - grinding the dies thinner so they fit within the same space after stacking.
Mobile RAM/Flash packages are usually made in larger capacities by stacking several dies within a package. This can involve die thinning - grinding the dies thinner so they fit within the same space after stacking.